What is Diamond Wafering?

Slurry wire wafering saw vs. diamond wire saw

Slurry wire for diamond slicing

A mixture of silicon carbide and glycol is used as an abrasive that erodes rather than cuts the ingot.
Grain particles roll between wire and material.
Grain particle speed is max ½ of wire speed.

Slurry wire saw wafering generally has:

Less damage to the substrate
Less wire deflection in inhomogeneous material.
Smoother surface

Precision Surfacion Solutions Wafer

Diamond wire wafering

Diamonds are applied to the wire to create a true cutting action
Grain particles glide over the workpiece
Grain particle speed equal to wire speed
Theoretical doubling of removal rate at same wire speed compared to slurry

Diamond wire saw wafering generally has:

Lower cost per wafer for most applications
Significantly higher wire speed possible
Higher material removal rate
More environmentally friendly due to water-based cutting fluids
Cleaner machine and workpieces
Better TTV (no wire taper)
Less heat generation and better heat dissipation